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Products & Services |
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Besi supplies leading edge systems offering increased productivity, improved yields of defect-free devices and a low cost of ownership. We offer customers a broad portfolio of systems which addresses substantially all the assembly process steps involved in leadframe, array connect and wafer level packaging. Our principal product offerings include:
- Die attach equipment: from which we produce single, multi-chip and flip chip die bonding systems and die sorting systems.
- Packaging equipment: from which we produce molding, trim and form and singulation systems.
- Plating equipment: from which we produce tin, copper and precious metal plating systems.
- Wire bonding equipment: from which we produce systems utilizing gold and copper wire.
- Services: for which we provide tooling, conversion kits and spare parts to our customers.
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