 |
Product & Services |
|
 |
 |
|
Besi’s principal products include:
 Die Bonding Equipment- Single-, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate.
- Die sorting systems which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations.
Packaging Equipment- Molding systems that encapsulate bonded semiconductor devices in epoxy resin.
- Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications.
- Singulation systems used to cut packaged array connect devices.
Plating Equipment- Fully automated tin plating and spot plating systems for conventional leadframe applications.
- Flexible antenna plating systems for new RFID and thin film solar cell applications.
The Company is engaged in one line of business, the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry.
|
 |
|
