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Company Profile |
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BE Semiconductor Industries N.V. and its subsidiaries is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. Our technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or “packages”, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields of defect-free devices at a low total cost of ownership. Our products are used to assemble chips for a wide variety of end-use applications including electronics, computer, automotive, industrial, RFID....
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September 15, 2009: Richard Blickman opens trading day at Euronext Amsterdam. |
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Press |
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December 8, 2009
BE Semiconductor Industries Announces Realignment of Packaging Systems Portfolio and 10% Company-Wide Headcount Reduction Targeting € 8.5 million in Annualized Cost Savings
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October 29, 2009
BE Semiconductor Industries Reports Third Quarter 2009 Results
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Company Calendar |
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(Semi) annual reports |
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